The PL-series CMP(Chemical Mechanical Polishing)tool is independently developed by GMC. Superior performance, simple operation,complete monitoring system.

FEATURES

6"&8"wafer,3 Platen CMP,suitable for Oxide, Poly, Cu, Si,SiC and others

Program scheduling is safe, stable and efficient; The software has powerful functions,beautiful interface, simple and easy to use

Data collection frequency and number of points can be adjusted to facilitate accurate tracking and positioning of anomalies

Polish head supports multi-zone control (3-5zone)

Cleaner robot can transfer wafers across modules to facilitate Process Trouble Shooting

Built-in camera,real-time monitoring and can be played back at any time,convenient for abnormal query and troubleshooting

TECHNICAL SPECIFICATION

Head air pressure control precision              <0.01psi

Head、 Platen rotation speed precision        <1RPM

Slurry/Chemical Flowrate control precision   <5ml

Within Wafer NU%                                         <4%