Application field:
In the semiconductor industry, front-end manufacturing (IC integrated circuits), back-end advanced packaging, and substrate materials (silicon wafers, silicon carbide, gallium nitride and other compounds) are used

Wafer size:
150mm-300mm

Device configuration:

Equipped with a combination of slot soaking and single piece rotating spray to improve production efficiency and reduce production costs;

High pressure or two fluid spraying can completely remove the photoresist;

Recycle and recycle the adhesive solution, filter and reuse it, reduce user costs, and recycle precious metals;

Dry in and wet out of the substrate, wet out of the soaking tank below the robotic arm, with a leaking tray;

Can be customized for drug circulation filtration, foaming, residue, etc., to solve process problems;

Customizable configuration, acid mixing and supply equipment, supporting diversified processes