Application field:
In the semiconductor industry, front-end manufacturing (IC integrated circuits), back-end advanced packaging, and substrate materials (silicon wafers, silicon carbide, gallium nitride and other compounds) are used

Wafer size:
150mm-300mm

Device configuration:

Equipped with a combination of slot soaking and single piece rotating spray to improve production efficiency and reduce production costs

High pressure or two fluid spraying can completely remove the photoresist

Recycle and recycle the adhesive solution, filter and reuse it, reduce user costs, and recycle precious metals

Dry in and wet out of the substrate, wet out of the soaking tank below the robotic arm, with a leaking tray

Can be customized for drug circulation filtration, foaming, residue, etc., to solve process problems

Customizable configuration, acid mixing and supply equipment, supporting diversified processes