GMC Semi-tech Co., Ltd.
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Mattson Aspen II ICP
  • Mattson Aspen II ICPBackList
    Equipment features:

    Mattson is authorized to produce new machines from the original factory

    Wide temperature range (100 ° C to 250 ° C)

    Double crystal wafer processing controlled by microcontroller, with good process uniformity

    Vacuum load lock isolation process room to reduce defects

    High speed robot for simultaneous processing of polycrystalline wafers - High throughput (> 130 wph)

    Small footprint with the highest throughput/square footprint in strip products smaller than 200mm

    Compared to microwave source strip products, the cost of consumables is lower

    VTM transmission to better ensure device particle requirements

    Single cavity or dual cavity process selection, single cavity can process two pieces simultaneously

    Supports 4 to 8-inch wafers


    Technical parameters:

    Strip rate: ≫ 5.6um/min

    Uniformity within wafer (descum):< 5%

    Uniformity within wafer (strip):< 5%

    Uniformity wafer to wafer (strip): ≪ 5%

    Uniformity run to run (strip): ≪ 5%

    Uptime: ≫ 90%

    1 minute process time (WPH):; one hundred and sixty

    Particle (0.3um):& Lt; 50ea

     
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