Uniform gel development process suitable for 4-8 inch silicon-based or compound applications

Maximum equipment configuration: 4 sets of uniform glue/development, 10 sets of hot (cold) plate units, and 1 set of HMDS units

According to customer process requirements, adhesive temperature and humidity control can be added

Compatible with 4+6 inch or 6+8 inch wafer sizes

The whole machine is suitable for batch production lines with high production capacity requirements

Optional MES protocol conversion module

Rotation speed range: 20-5000rpm

Acceleration range: 20-20000rpm/s

Speed accuracy: soil 1rpm

Hot plate temperature range: 50 ° C-260 ° C

Hot plate temperature uniformity: ± 1% or higher

Cold plate temperature range: 20 ° C-25 ° C

Uniformity of cold plate temperature: soil 0.2C

Photoresist viscosity: 0-1000Cp (optional high viscosity)

Rubber pump type: pneumatic or electric rubber pump

Photoresist or developer tubing:<= 3-way

Flow monitoring: Float flowmeter (optional ultrasonic flowmeter)