Use adsorption and adsorption medium to treat semiconductor or compound process gas
Injecting gas (ASH3, PH3, BF3, etc.)
Corrosive gas (F2, CL2, BCL3, HBR, etc.)
Process used:Dry etch/Implant/MOCVD(AsH3)/PLD(SiC)
Principle:Gas treatment is carried out through the chemical adsorption particles of G-FLYING CLEARB.
The basic component of the device inside the absorption tower is G-FLYING CLEARB chemisorbed particles.
The adsorption process forms stable salt separation of harmful process gases through chemical conversion (chemical adsorption), which takes place at room temperature without the need for external heating, humidification, or other functional facilities.
The chemical absorption reaction between gas and absorbent is irreversible, ensuring that hazardous gases remain in solid form.
