Suitable for high-temperature plasma treatment of semiconductor or compound process gases.
PFCs gas: CF4, SF6, NF3, etc
Corrosive gases: Cl2, F2, BCl3, HBr, etc
Combustible gases: SiH4, TEOS, DCS, H2, etc
Process used:Dry etch/Thin Film/Implant
Advantages:Easy installation and maintenance, with short PM time.
The exhaust inlet pipe can be KF50 to avoid dust adhesion and prolong the PM cycle.
Unique internal structural design, economical C O. O and C O. C, low usage cost.
Optional water-saving model, water recycling, with extremely low water consumption.
Efficient high-temperature burners are used in various manufacturing processes to effectively select high and low power, reducing operating costs.
