Suitable for high-temperature plasma treatment of semiconductor or compound process gases.
PFCs gas: CF4, SF6, NF3, etc
Corrosive gases: Cl2, F2, BCl3, HBr, etc
Combustible gases: SiH4, TEOS, DCS, H2, etc
Process used:Dry etch/Thin Film/Implant
Advantages:Plasma torch can release high temperatures exceeding 3000 ℃, making it more efficient in handling flammable gases, toxic gases, and PFC gases.
Especially the ability to handle PFC gases.
The specially designed water spray system does not produce water mist during the treatment of water-soluble waste gas.
