Application field:
Advanced packaging processes such as TSV, TGV, Pillar, RDL, Bump, Damascus electroplating, etc.

Wafer size:
100-300mm (flake size: 200um-750um)

Device configuration:

Fully support the SECS/GEM communication protocol;

Electroplating: Cu, Ni, Sn/Ag, Au;

Supports 3 loadports;

Support the expansion of 16 electroplating chambers;

Support the expansion of 4 pre wetting chambers and 4 cleaning chambers;

Special defoaming mechanism to eliminate bubbles in the plating solution;

The system is equipped with dual System controllers, with no risk of downtime;

Support electroplating chamber stirring function, with adjustable frequency;

Equipped with imported high-precision DC pulse power supply;

Support modular maintenance to improve equipment uptime;

The separation technology of anode and cathode improves the stability of the plating solution.

Process indicators:
Electroplating uniformity:
WiWNU ≤ 3%;
WtWNU ≤ 3%