Application field:
Advanced packaging processes such as TSV, TGV, Pillar, RDL, Bump, Damascus electroplating, etc.

Wafer size:
100-300mm (flake size: 200um-750um)

Device configuration:

Fully support the SECS/GEM communication protocol

Electroplating: Cu, Ni, Sn/Ag, Au

Supports 3 loadports

Support the expansion of 16 electroplating chambers

Support the expansion of 4 pre wetting chambers and 4 cleaning chambers

Special defoaming mechanism to eliminate bubbles in the plating solution

The system is equipped with dual System controllers, with no risk of downtime

Support electroplating chamber stirring function, with adjustable frequency

Equipped with imported high-precision DC pulse power supply

Support modular maintenance to improve equipment uptime

The separation technology of anode and cathode improves the stability of the plating solution

Process indicators:
Electroplating uniformity:
WiWNU ≤ 3%;
WtWNU ≤ 3%