GMC Semi-tech Co., Ltd.
WET - Fully automatic RCA cleaning equipment Chemical nickel palladium equipment Grinding and Polishing integrated machines Electroplating equipment Single Wafer Cleaner Wafer Thinning machines WET - Fully automatic wet glue removal equipment ASHER CLEAN TRACK Liquid supply system LOCAL SCRUBBER Heat Exchanger Wafer Dicing machine
WET(GMC-ENEPIG-300)
  • WET(GMC-ENEPIG-300)BackList
    Application field:
    IGBT/FRD/MOS/SBD and other wafer front and back metallization, wafer level advanced packaging, UBM metallization

    Wafer size:
    100-300mm (50-150um Taiko wafer, Normal 750um wafer)

    Device configuration:

    Fully support the SECS/GEM communication protocol;

    Automated and intelligent online analysis and addition system for nickel, palladium, and gold tanks;

    Automatic liquid dispensing, replenishment, and acid exchange;

    Temperature, flow rate, concentration, pressure, controllable and adjustable;

    Support modular maintenance to improve equipment uptime;

    The software has a reverse function, and slot positions can be freely selected and combined;

    The equipment process slot has a special flow field distribution design, effectively improving the uniformity of the coating;

    Equipment automation operation, dry in and dry out;

    We can provide overall solutions for equipment, medicine, and processes.


    Film thickness:

    Ni/3 ± 0.3um& Nbsp; Pd/0.3 ± 0.03um& Nbsp; Au/0.05 ± 0.005um

    Process indicators:

    WIW: U%< 10%
    WTW: U%< 10%
     
International brands Equipment refurbishment GMCs Brand Semiconductor Materials Process Line