GMC Semi-tech Co., Ltd.
Wafer Thinning machines Grinding and Polishing integrated machines Wafer Dicing machine Electroplating equipment WET - Fully automatic chemical nickel and palladium equipment WET - Fully automatic cleaning equipment Single Wafer Cleaner WET - Fully automatic wet glue removal equipment CLEAN TRACK ASHER Liquid supply system Chiller/Heat Exchanger LOCAL SCRUBBER
WET(GMC-ENEPIG-300)
  • WET(GMC-ENEPIG-300)BackList
    Application field:
    IGBT/FRD/MOS/SBD and other wafer front and back metallization, wafer level advanced packaging, UBM metallization

    Wafer size:
    100-300mm (50-150um Taiko wafer, Normal 750um wafer)

    Device configuration:

    Fully support the SECS/GEM communication protocol

    Automated and intelligent online analysis and addition system for nickel, palladium, and gold tanks

    Automatic liquid dispensing, replenishment, and acid exchange

    Temperature, flow rate, concentration, pressure, controllable and adjustable

    Support modular maintenance to improve equipment uptime

    The software has a reverse function, and slot positions can be freely selected and combined

    The equipment process slot has a special flow field distribution design, effectively improving the uniformity of the coating

    Equipment automation operation, dry in and dry out

    We can provide overall solutions for equipment, medicine, and processes


    Film thickness:

    Ni/3 ± 0.3um& Nbsp; Pd/0.3 ± 0.03um& Nbsp; Au/0.05 ± 0.005um

    Process indicators:

    WIW: U%< 10%
    WTW: U%< 10%
     
International brands Equipment refurbishment GMCs Brand Semiconductor Materials Process Line