Fully support the SECS/GEM communication protocol;
Electroplating: Cu, Ni, Sn/Ag, Au;
It can support single and double-sided electroplating, as well as simultaneous electroplating of multiple pieces;
Support modular maintenance to improve equipment uptime;
Temperature, flow rate, concentration, pressure, controllable and adjustable;
Can customize R&D customized machines for various research institutions;
Optional multiple loadports, equipped according to production capacity;
Can provide overall solutions for equipment, medicine, and process;
Equipment automation operation, dry in and dry out
Process indicators:
