Application field:
In the semiconductor industry, front-end manufacturing (IC integrated circuits), back-end advanced packaging, substrate materials (silicon wafers, silicon carbide, gallium nitride and other compounds), and are also suitable for glass substrates and other fields.

Application method:
Cassette type& Cassetteless type

Wafer size:
100mm-300mm

Device configuration:

Fully support the SECS/GEM communication protocol;

Equipment automation operation, dry in dry out (Marangoni dry or spin dry)

Equipped with an automatic fire safety system;

Automatic liquid dispensing, replenishment, and acid exchange;

Temperature, flow rate, concentration, pressure, controllable and adjustable;

Optional multiple loadports, equipped according to production capacity;

Full process monitoring and sensor safety interlock;

Full online technical support.

Main brands:
The main parts are selected from top foreign brands (Rochling, KAIJO, IWAKI/Polar, Entegris, CKD/SEBA, SIEMENS/OMRON)