Application field:
In the semiconductor industry, front-end manufacturing (IC integrated circuits), back-end advanced packaging, substrate materials (silicon wafers, silicon carbide, gallium nitride and other compounds), and are also suitable for glass substrates and other fields.

Application method:
Cassette type& Cassetteless type

Wafer size:
100mm-300mm

Device configuration:

Fully support the SECS/GEM communication protocol

Equipment automation operation, dry in dry out (Marangoni dry or spin dry)

Equipped with an automatic fire safety system

Automatic liquid dispensing, replenishment, and acid exchange

Temperature, flow rate, concentration, pressure, controllable and adjustable

Optional multiple loadports, equipped according to production capacity

Full process monitoring and sensor safety interlock

Full online technical support

Main brands:
The main parts are selected from top foreign brands (Rochling, KAIJO, IWAKI/Polar, Entegris, CKD/SEBA, SIEMENS/OMRON)