Application field:
In the semiconductor industry, front-end manufacturing (IC integrated circuits), back-end advanced packaging, and substrate materials (silicon wafers, silicon carbide, gallium nitride and other compounds) are used

Wafer size:300mm

Device configuration:

Development of advanced transportation systems and proprietary algorithms through put: 400WPH;

Equipped with nitrogen atomization for two fluid cleaning;

Adopting anti-static pipelines and adjustable CO2 generator resistivity;

Equipped with customized soft brush cleaning and scanning to the edge for brushing;

The wafer flipping function allows for back and front cleaning;

Configure 8 sets of brush cleaning chambers and 2 sets of flipping mechanisms.