Application field:
In the semiconductor industry, front-end manufacturing (IC integrated circuits), back-end advanced packaging, and substrate materials (silicon wafers, silicon carbide, gallium nitride and other compounds) are used

Wafer size:300mm

Device configuration:

Development of advanced transportation systems and proprietary algorithms through put: 400WPH

Equipped with nitrogen atomization for two fluid cleaning

Adopting anti-static pipelines and adjustable CO2 generator resistivity

Equipped with customized soft brush cleaning and scanning to the edge for brushing

The wafer flipping function allows for back and front cleaning

Configure 8 sets of brush cleaning chambers and 2 sets of flipping mechanisms